Resistance memory cell

ABSTRACT

A resistance memory includes a resistance memory cell having a resistance memory element and a two-terminal access device in series. The two-terminal access device affects the current-voltage characteristic of the resistance memory cell. The resistance memory additionally includes a circuit to apply across the resistance memory cell a set pulse having a set polarity to set the resistance memory cell to a low-resistance state that is retained after application of the set pulse, a reset pulse having a reset polarity, opposite to the set polarity, to reset the resistance memory cell to a high-resistance state that is retained after application of the reset pulse, and a read pulse of the reset polarity and smaller in magnitude than the reset pulse to determine the resistance state of the resistance memory cell without changing the resistance state of the resistance memory cell.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of U.S. patent application Ser. No.15/924,086, filed on Mar. 16, 2018, which is a Continuation of U.S.patent application Ser. No. 15/040,921, filed on Feb. 10, 2016, entitled“RESISTANCE MEMORY CELL”, now U.S. Pat. No. 9,934,851, which is aContinuation of U.S. patent application Ser. No. 14/125,913, filed onDec. 12, 2013, entitled “RESISTANCE MEMORY CELL”, now U.S. Pat. No.9,305,644, which claims priority from International Application No.PCT/US2012/043884 published as WO 2012/178114 A1 on Dec. 27, 2012, whichclaims priority from U.S. Provisional Application No. 61/500,887, filedon Jun. 24, 2011, entitled “RESISTANCE MEMORY CELL.” Theabove-referenced applications are hereby incorporated by reference intheir entirety.

BACKGROUND

A conductive-bridging resistance-change memory element, which will bereferred to herein as a resistance memory element, has at least twodistinct stable resistance states: a low-resistance state and ahigh-resistance state. A resistance memory element can be switched froma high-resistance state to a low-resistance state by the application ofa voltage pulse of one polarity and can be switched from alow-resistance state to a high-resistance state by the application of avoltage pulse of the opposite polarity. Each resistance state is used torepresent a respective data value, e.g., 1 or 0. Since the resistancechanges can be accomplished by applying low-voltage pulses to theresistance memory element, and the resistance state of the resistancememory element can be determined by applying a voltage or a current tothe resistance memory element, resistance memory elements are attractivefor use in low-cost, high-density memory arrays.

FIG. 1 depicts the basic current-voltage characteristics of an exemplaryresistance memory element. Initially, the resistance memory element isin a high-resistance state. Applying a positive voltage pulse having amagnitude greater a first threshold voltage that will be referred toherein as a SET voltage to the resistance memory element causes theresistance of the resistance memory element to drop by several orders ofmagnitude and a corresponding increase in the current through theresistance memory element. In an example, the SET voltage is about 250millivolts (mV). Applying a positive voltage pulse having a magnitudegreater than the SET voltage changes the resistance memory element froma high-resistance state that will be referred to as a reset state to alow-resistance state that will be referred to herein as a set state. Thehigh-resistance state of a resistance memory element will be referred toherein as a reset state and the low-resistance state will be referred toas a set state. The names of the states can be interchanged.

Applying a negative voltage pulse having a magnitude greater than asecond threshold voltage that will be referred to herein as a RESETvoltage causes the resistance of the resistance memory element toincrease by several orders of magnitude and a corresponding decrease inthe current through the resistance memory element. In an example, theRESET voltage is about −80 mV. Applying a negative voltage pulse havinga magnitude greater than the RESET voltage changes the resistance memoryelement from the low-resistance set state back to the high-resistancereset state.

Application of a read pulse having a voltage less than the SET voltageto the resistance memory element causes a read current to flow throughthe resistance memory element. As shown in FIG. 1, the read currentdiffers significantly depending on whether the resistance memory elementis in the low-resistance set state or in the high-resistance resetstate. By measuring the read current (or comparing the read current witha threshold), the resistance state of the resistance memory element canbe detected and, hence, the data represented by the resistance state ofthe resistance memory element can be read.

In a memory array composed of resistance memory elements, parasiticcurrents can pass through unselected resistance memory elements. Suchparasitic currents can make it difficult or impossible to determinewhether the measured read current represents the high-resistance stateor the low-resistance state of the resistance memory element that wasselected to be read. Since the read current is used to determine thedata value stored in the resistance memory element, it is consequentlydifficult to determine the value of the stored data. To alleviate thisproblem, access devices are used to select the resistance memory elementto be read. The access devices are used to suppress or minimize theparasitic currents that flow through unselected resistance memoryelements. However, the use of an access device alters thecurrent-voltage behavior of a resistance memory cell that incorporates aresistance memory element and an access device.

BRIEF DESCRIPTION OF THE DRAWINGS

The subject matter disclosed is illustrated by way of example, and notby way of limitation, in the figures of the accompanying drawings inwhich the like reference numerals refer to similar elements and inwhich:

FIG. 1 is a graph showing the current-voltage characteristic aresistance memory element;

FIGS. 2A-2C are cross-sectional views of the physical structures ofresistance memory cells in accordance with various embodiments;

FIG. 3 is a block diagram showing an exemplary memory device utilizingresistance memory cells in accordance with various embodiments;

FIG. 4 is a block diagram showing a portion of an exemplary memory arrayused in the memory device shown in FIG. 3;

FIG. 5 is a graph showing the current-voltage characteristic of anexemplary two-terminal access device;

FIG. 6 is a graph showing the current-voltage characteristic of anexample of a resistance memory cell read using read voltages of the setpolarity in accordance with an embodiment;

FIG. 7 is a graph showing the current-voltage characteristic of aresistance memory cell read using read voltages of the reset polarity inaccordance with an embodiment; and

FIG. 8 is a graph showing the dynamic resistance-voltage characteristicof a resistance memory cell in accordance with various embodiments.

DETAILED DESCRIPTION

A number of different memory technologies are based on resistancechange. Magneto resistance random access memories utilize a magneticfield to affect the resistance change. Phase-change random accessmemories utilize thermal processes to control a phase transition in aresistance change material. The phase transition is from an amorphous toa crystalline state. A conductive-bridging resistance-change randomaccess memory (“CB-RAM”) is a type of resistance change memorytechnology that is based on the electrically-stimulated change of theresistance of a metal-insulator-metal resistance memory cell.

CB-RAM memory elements based on solid electrolytes, sometimes known asprogrammable metallization elements, are of particular interest due tothe ability of low voltages to change their resistance states and theirpotential for high scalability. Typically, CB-RAM memory elements, whichare referred to herein as resistance memory elements have a dielectricmaterial disposed between two electrodes. One of the electrodes iscomposed of a metal that is a source of mobile ions of the metal, and isreferred to herein as an active electrode. The other of the electrodesis composed of a metal that is not a significant source of ions of themetal, and is referred to herein as an inert electrode. Initially, theresistance between the electrodes is high, and the resistance memoryelement is said to be in a high-resistance state. Application of a setpulse having a first characteristic between the electrodes forms one ormore conductive metal filaments that extend through the dielectricmaterial from the active electrode to the inert electrode. The filamentis composed of metal supplied by the active electrode. Formation of thefilament establishes a conductive path that significantly reduces theresistance between the electrodes. After the conductive filaments havebeen established, the resistance memory element is said to be in itslow-resistance state in which the resistance between the electrodes isseveral orders of magnitude less than in the high-resistance state.Application of a reset pulse having a second characteristic, differentfrom the first characteristic, breaks the conductive filament, whichresets the resistance memory element to its high-resistance state.Reapplication of a set pulse having the first characteristic re-formsthe conductive filament, which once more sets the resistance memoryelement to its low-resistance state. The resistance state of theresistance memory element can be changed by application of electricalpulses having appropriate characteristics. The resistance memory elementretains its resistance state after application of the electrical pulse.The persistence of the electrical states after application of theelectrical pulses depends at least on the properties of the resistancememory element and the characteristics of the electrical pulses. In somecases, the persistence can be sufficiently long that the resistancememory element can be regarded as a non-volatile memory element.

In accordance with various embodiments, a resistance memory includes aresistance memory cell having a resistance memory element and atwo-terminal access device connected in series with the resistancememory element. The two-terminal access device is configured to enable abi-directional flow of current through the resistance memory element inresponse to application of a voltage greater than a threshold voltage.The resistance memory additionally includes a circuit that appliesacross the resistance memory cell what will be referred to herein as aset pulse having a set polarity to set the resistance memory cell to alow-resistance set state that is retained after application of the setpulse, that applies across the resistance memory cell what will bereferred to herein as a reset pulse having a reset polarity, oppositethe set polarity, to reset the resistance memory cell to ahigh-resistance reset state that is retained after application of thereset pulse and that applies across the resistance memory cell what willbe referred to herein as a read pulse of the reset polarity and smallerin magnitude than the reset pulse to determine the resistance state ofthe resistance memory cell without changing the resistance state of theresistance memory cell.

FIGS. 2A, 2B and 2C are cross-sectional views showing examples ofresistance memory cells 100, 102, 104 in accordance with variousembodiments. The resistance memory cell embodiments can be used inapplications that currently use, for example, DRAM, SRAM, PROM, EPROM,NAND or NOR memory cells. The physical structure of the resistancememory cells may be configured in various forms. Regardless of the form,each resistance memory cell 100, 102, 104 includes a resistance memoryelement having an inert electrode 110, an electrolyte layer 112, and anactive electrode 114, and a two-terminal access device 118 connected inseries with the resistance memory element. The two-terminal accessdevice 118 may be located almost anywhere within resistance memory cell100, 102, 104 except that it may not be interposed between theelectrolyte layer 112 and the active electrode 114.

FIG. 2A shows an example of a resistance memory cell 100 in accordancewith an embodiment. The resistance memory cell 100 has a substrate 116over which are located, in order, a first contact electrode 120; anactive electrode 114; an electrolyte layer 112; an inert electrode 110;a two-terminal access device 118; and a second contact electrode 122.Examples of the material of the substrate 116 include, but are notlimited to, monocrystalline silicon, silicon-germanium,silicon-germanium-carbon, or any other semiconductor material.Typically, other circuitry (not shown) is fabricated in and/or on thesubstrate 116 in addition to the resistance memory cell 100.

In an embodiment, the first and second contact electrodes 120, 122 areportions of conductive array lines (e.g., word lines or bit lines). Thefirst contact electrode 120 is formed by depositing a layer of contactelectrode material over the substrate 116 using a suitable depositionprocess such as, but not limited to, sputtering, evaporation or chemicalvapor deposition. The layer of contact electrode material is thenpatterned to define the first contact electrode 120. The contactelectrode material of the first contact electrode 120 and the secondcontact electrode 122 can be any material that is electricallyconductive and does not react with metal ions in the layers in contactwith the respective contact electrode 120, 122. Examples of contactelectrode material include, but are not limited to, platinum (Pt),tungsten (W), aluminum (Al), palladium (Pd), iridium (Ir), and alloysthat include these metals.

The material of the active electrode 114 is anelectrochemically-reactive metal, such as silver (Ag) or copper (Cu),which is a source of mobile metal ions. In an example, a layer of thematerial of the active electrode 114 is deposited over the substrate 116by any suitable deposition technique (e.g., evaporative deposition,sputtering deposition, electroplating, etc.) and is then patterned usingany suitable patterning process (e.g., selective chemical etching, etc.)to define the active electrode 114. The thickness of the activeelectrode 114 depends on a conductance preference.

The electrolyte layer 112 is interposed between the active electrode 114and the inert electrode 110. The material of the electrolyte layer 112is a solid electrolyte. Examples include, but are not limited to,germanium selenide (GeSe) and germanium sulfide (GeS). The electrolytelayer 112 is formed by depositing a layer of electrolyte material usinga sputtering deposition process such as radio frequency sputtering ormagnetron sputtering. The thickness of electrolyte material deposited istypically between 20 nm-200 nm. The layer of electrolyte material isthen patterned to define the electrolyte layer 112 using a suitablepatterning process, such as a selective chemical etch.

The inert electrode 110 is located in contact with the electrolyte layer112 opposite the active electrode 114. The material of the inertelectrode 110 is a chemically-inert electrical conductor. Examples ofthe material of the inert electrode 110 include, but are not limited to,tungsten (W), titanium (Ti), aluminum (Al), nickel (Ni), platinum (Pt)and alloys that include these metals. The inert electrode 110 is formedby depositing a layer of inert electrode material by a process such asvacuum evaporation or sputtering, and then patterning the layer using asuitable patterning process. The inert electrode 110 has a minimumthickness of about 50 nanometers (nm).

The two-terminal access device 118 is composed of a metal oxide film 119interposed between two electrodes. In the example shown in FIG. 2A, theinert electrode 110 and the second contact electrode 122 provide theelectrodes of the two-terminal access device 118. The metal oxide film119 of the two-terminal access device 118 is a thin film of a metaloxide such as, but not limited to, magnesium oxide (MgO), aluminum oxide(Al₂O₃), silicon dioxide (SiO2), and zinc oxide (ZnO). In an example,the metal oxide film 119 of the two-terminal access device 118 is formedby depositing a thin layer of a metal oxide over the inert electrode 110using atomic layer deposition, and then patterning the metal oxide layerto define the metal oxide film. In another example, a thin layer ofmetal (e.g., aluminum) is deposited over the inert electrode 110. Themetal layer is patterned and then oxidized to form the metal oxide film119 of the two-terminal access device 118.

The second contact electrode 122 is formed by depositing a layer ofcontact electrode material using a deposition process that will notdamage the metal oxide film 119 of the two terminal access device 118.In an example, a layer of contact electrode material is deposited overthe metal oxide film 119 by evaporation or chemical vapor deposition.The layer of contact electrode material is then patterned to define thesecond contact electrode 122.

FIG. 2B shows an example of a resistance memory cell 102 in accordancewith another embodiment in which the two-terminal access device 118 isinterposed between the inert electrode 110 and the electrolyte layer112. In this embodiment, the two-terminal access device 118 includes aninternal electrode 124 located over electrolyte layer 112 that providesone electrode of the two-terminal access device 118, and the metal oxidefilm 119 of the two-terminal access device 118 is located over theinternal electrode 124. The inert electrode 110 is located over themetal oxide film 119 and provides the other electrode of thetwo-terminal access device 118. The internal electrode 124 isolates themetal oxide film 119 of the two-terminal access device from theelectrolyte layer 112. The internal electrode 124 is formed bydepositing a layer of contact electrode material over the electrolytelayer 112 by a suitable deposition process, and patterning the layer ofcontact electrode material to define the internal electrode. The metaloxide film 119 of the two-terminal access device is then formed over theinternal electrode in a manner similar to that described above withreference to FIG. 2A.

FIG. 2C shows an example of a resistance memory cell 104 in accordancewith another embodiment in which the two-terminal access device 118 islocated between the second contact electrode 122 and the activeelectrode 114. In this embodiment, the two-terminal access deviceincludes the internal electrode 124 over the metal oxide film 119. Theinternal electrode provides one electrode of the two-terminal accessdevice. The first contact electrode 120 provides the other electrode ofthe two-terminal access device. The internal electrode 124 isolates themetal oxide film 119 of the two-terminal access device 118 from theactive electrode 114. In this embodiment, the metal oxide film 119 ofthe two-terminal access device 118 is formed over the first contactelectrode 120 in a manner similar to that described above with referenceto FIG. 2A. The internal electrode 124 is formed by depositing a layerof contact electrode material over the metal oxide film 119 using adeposition process that will not damage the metal oxide film 119, andpatterning the layer of contact electrode material to define theinternal electrode. A layer of active electrode material is thendeposited and is patterned to define the active electrode 114.

Each of the resistance memory cells 100, 102, 104 has two stableresistance states that enable the resistance memory cell to represent abinary data value, either a ‘0’ data value or ‘1’ data value. Theconvention used to associate a data value with a resistance state of theresistance memory cell is arbitrary. For the purposes of thisdisclosure, a resistance memory cell 100, 102, 104 is said to representa ‘1’ data value when in its reset state and to represent a ‘0’ datavalue when in its set state. As noted above, the set state of theresistance memory cell refers to the low-resistance state of theresistance memory cell, and the reset state of the resistance memorycell refers to the high-resistance state of the resistance memory cell.The names of the high-resistance state and the low-resistance state maybe interchanged, however.

Each resistance memory cell 100, 102, 104 is changed from itshigh-resistance state to its low-resistance state by applying between aset pulse between the active electrode 114 and the inert electrode 110.The set pulse is a voltage pulse having a defined voltage and duration,and a polarity such that active electrode 114 is positive with respectto the inert electrode 110. The set pulse will be referred to herein ashaving a positive polarity. Applying the set pulse to resistance memorycell 100, 102, 104 is referred to herein as performing a set operation.Depending on the material of the electrolyte layer 112 and thedimensions of the resistance memory cell, the resistance of theresistance memory cell 100, 102, 104 in the set state typically rangesfrom 10² to 10⁴ ohms.

Each resistance memory cell 100, 102, 104 is changed from itslow-resistance set state to its high-resistance reset state by applyinga reset pulse between active electrode 114 and inert electrode 110. Thereset pulse is a voltage pulse having a defined voltage and duration,and a polarity opposite that of the set pulse. Applying the reset pulseto the resistance memory cell is referred to herein as a performing areset operation. Depending on the material of the electrolyte layer 112and the dimensions of the resistance memory cell, the resistance of theresistance memory cell in the reset state typically ranges from 10⁶-10⁸ohms.

In some applications, the resistance memory cells 100, 102, 104 areincorporated into a memory device 300, an example of which is shown inFIG. 3. In the example shown, the memory device 300 is embodied as amemory integrated circuit (IC) supported by a common structure andcoupled directly to other ICs, such as a memory controller (not shown).In an example, one or more other ICs and the memory IC embodying memorydevice 300 are packaged within a single multi-chip module and areconnected by bond wires or other conducting structures, such asthrough-semiconductor vias (TSVs). In another embodiment, the memorydevice 300 is part of a memory system or memory module that, togetherwith one or more circuits, such as a memory controller, constitutes partof an IC. Memory device 300 is connected to such one or more othercircuits by traces defined in one or more metal layers or otherconducting structures within the IC.

In the example shown, the memory device 300 has a control circuit 302, avoltage source 304, a read circuit 306, a bit line decoder 308, a wordline decoder 310, and a memory array 312. The control circuit 302controls the read, set, and reset operations on the memory array 312.The control circuit 302 receives address (ADDR), command (CMD), data(DATA), and clock (CLK) signals from a data bus connected to an externalsource (e.g., a memory controller). The voltage source 304 supplies tothe bit line decoder 308 and the word line decoder 310 the voltages andvoltage pulses needed to perform read, set, and reset operations. Theread circuit 306 includes a sense amplifier (not shown) that receives aread current from a resistance memory cell selected by the bit linedecoder 308 and from the read current determines the resistance state ofthe resistance memory cell. The word line decoder 310 selects the wordline of the memory array 312 corresponding to the address input and thebit line decoder 308 selects the bit line of the memory array 312corresponding to the address input.

FIG. 4 shows a portion of an example of the memory array 312. In anembodiment, the memory array 312 is arranged in a cross-pointconfiguration having word lines WL 324A, 324B and bit lines, BL 322A,322B. The word lines WL 324A, 324B and the bit lines BL 322A, 322B,extend orthogonally to each other and a resistance memory cell 320 islocated at each intersection of a word line and a bit line. The wordlines WL 324A, 324B are coupled to the word line decoder 310, whichselects one of the word lines connected to a corresponding row of theresistance memory cells 320. The bit lines BL 322A-322D are coupled tothe bit line decoder 308, which selects one of the bit lines connectedto a corresponding column of the resistance memory cells 320. Theresistance memory cell 320 at the intersection of the selected word lineand the selected bit line is subject to a read, reset or set operation,depending on the duration, magnitude and polarity of respective voltagepulses applied across the resistance memory cell via the selected wordline and the selected bit line.

FIG. 4 also shows an example of a resistance memory cell 320A that has atwo-terminal access device 326 embodied as a tunnel diode 327 connectedin series with a resistance memory element 328. FIG. 4 also showsanother example of a resistance memory cell 320B that has a two-terminalaccess device 326 embodied as two back-to-back diodes 330 connected inparallel. The two-terminal access device 326 is connected in series withthe resistance memory element 328. The diodes 330 may be junctiondiodes, Schottky diodes or back-to-back diodes of another suitable type.The diodes are typically fabricated in and/or on the substrate 116 (FIG.2A-2C)

Regardless of the embodiment of the two-terminal access device 326, theresistance memory cells 320A, 320B are connected between first terminals332A, 332B, respectively, and second terminals 334A, 334B, respectively.The first terminals 332A, 332B are connected to a respective word line324A, 324B and the second terminals are connected to a respective bitline 322C, 322D.

The two-terminal access device 326 allows current to flow in eitherdirection through the resistance memory element 328 during memoryoperations (i.e., read, set, or reset operations) performed on theselected resistance memory cell 320. Each resistance memory cell 320 issubject to a chosen memory operation by a corresponding voltage pulseapplied across the resistance memory cell. The voltage of the voltagepulse applied to the resistance memory cell 320 is the voltagedifference between a voltage on the selected wordline 324A, 324B and avoltage on the selected bit line 322A-322D. Voltage pulses may beapplied to both the selected wordline and the selected bitline, or toonly one of the selected wordline and the selected bitline, with aconstant voltage being applied to the other of the selected wordline andthe selected bitline. The voltages applied to the selected wordline andthe selected bitline are voltages relative to an arbitrary reference,such as ground or a common source voltage Vss.

Operation of the memory array 312 will now be described. Referencesbelow to a voltage applied to or across a memory cell refer to thevoltage of a voltage pulse applied across the memory cell. The presenceof the two-terminal access device 326 in the resistance memory cell 320imposes a voltage threshold on the current-voltage characteristic of theresistance memory cell. The voltage applied across the selectedresistance memory cell 320 needs to exceed a threshold voltage before acurrent sufficient to perform a memory operation can flow through theresistance memory cell. The threshold characteristic of the two-terminalaccess device 326 in each resistance memory cell 320 reduces oreliminates the parasitic current that would otherwise flow through eachunselected resistance memory cell 320 having a terminal 332, 334electrically coupled to the selected word line 324A, 324B or theselected bit line 322A-322D.

When a relatively low voltage is applied across resistance memory cell320, as occurs when the resistance memory cell 320 is not selected for amemory operation, the voltage across the two-terminal access device 326is also low. As a result, the two-terminal access device has a highdynamic resistance. The dynamic resistance of the two-terminal accessdevice is the rate of change of voltage with current at a given voltageacross the two-terminal access device. The high dynamic resistance ofthe two-terminal access device significantly reduces the parasiticcurrent flow. In a typical embodiment, the high dynamic resistance ofthe two-terminal access device reduces the parasitic current flow toless than a threshold current at which the parasitic current can beregarded as being negligible. Accordingly, the two-terminal accessdevice can be said to eliminate the parasitic current flow through thenon-selected resistance memory cells.

When a higher voltage is applied across the resistance memory cell 320,as occurs when the resistance memory cell 320 is selected for a memoryoperation, the dynamic resistance of the two-terminal access device 326falls to a level that is small compared with the resistance of theresistance memory element 328. The low dynamic resistance of thetwo-terminal access device allows set and reset operations to beperformed on the resistance memory cell 320, and allows the resistancestate of the resistance memory element 328 to be rapidly and reliablydetermined during read operations. Since the read, set, and resetvoltages applied to the resistance memory cell 320 during memoryoperations collectively have both positive and negative polarities,two-terminal access device 326 has a threshold current-voltagecharacteristic in both the forward and reverse directions. Typically,the two-terminal access device 326 has a symmetrical non-linearcurrent-voltage characteristic. As used in this disclosure, the termsymmetrical will be taken also to encompass near-symmetrical.

FIG. 5 is a graph showing the current-voltage characteristic of anexample of the two-terminal access device 326. In the example shown, thecurrent-voltage characteristic is symmetrical between voltages ofpositive polarity and applied voltages of negative polarity. Thecurrent-voltage characteristic of the two-terminal access device issufficiently non-linear that it can be regarded as being a thresholdcharacteristic: a voltage greater that a threshold voltage is needed forthe two-terminal access device to conduct a current greater than adefined current. In the example of two-terminal access device 326 shown,an applied voltage of +0.7 V or an applied voltage of −0.7 V is neededfor the two-terminal access device to conduct a current greater thanapproximately 1 μA. Referring additionally to FIG. 4, elementsexhibiting a near-symmetrical or symmetrical non-linear current-voltagecharacteristic and suitable for use as the two-terminal access device326, include, but are not limited to, a tunnel diode 327 and twoback-to-back diodes 330 connected in parallel.

Referring again to FIG. 4, the resistance memory cell 320 is composed ofthe resistance memory element 328, whose resistance (regardless ofwhether the resistance memory element is in its set state or its resetstate) during a read operation is relatively voltage independent, andthe two-terminal access device 326, whose dynamic resistance is highlyvoltage dependent. The resistance memory element and the two-terminalaccess device form a potential divider. Any voltage applied across theresistance memory cell 320 is divided into a voltage across theresistance memory element 328 and a voltage across the two-terminalaccess device 326. Only the voltage across the resistance memory element328 will change the state of the resistance memory element. The divisionof the applied voltage across the resistance memory element 328 and thetwo-terminal access device 326 is determined by the resistance of theresistance memory element and the dynamic resistance of the two-terminalaccess device, which is highly voltage dependent.

With a voltage of small magnitude (the polarity is immaterial to thispart of the disclosure) applied to the resistance memory cell 320, thedynamic resistance of the two-terminal access device 326 dominates theresistance of the resistance memory cell 320 and relatively little ofthe applied voltage appears across the resistance memory element 328. Asthe magnitude of the applied voltage increases, the dynamic resistanceof the two-terminal access device 326 decreases roughly in proportion tothe exponent of the increase in voltage across the two-terminal accessdevice. Consequently, a greater fraction of the applied voltage appearsacross the resistance memory element 328.

A relatively low set voltage is sufficient to change a resistance memorycell 320 whose resistance memory element 328 is in the high-resistancereset state to the set state. In the high-resistance reset state of theresistance memory element 328, a smaller fraction of the set voltageapplied to the resistance memory cell 320 appears across thetwo-terminal access device 326, and a greater fraction of the setvoltage appears across the resistance memory element 328. Consequently,the SET voltage of the resistance memory element 328 will be obtainedwith a relatively low set voltage applied across the resistance memorycell 320. In an example, the set voltage is 1.2 V.

A higher reset voltage is needed to change a resistance memory cell 320whose resistance memory element is in the low-resistance set state tothe reset state. In the low-resistance set state of the resistancememory element, a greater fraction of the set voltage applied to theresistance memory cell 320 appears across the two-terminal access device326, and a smaller fraction of the reset voltage appears across theresistance memory element 328. Consequently, a relatively high resetvoltage has to be applied across the resistance memory cell 320 beforethe RESET voltage of the resistance memory element 328 is obtained. Inan example, the reset voltage is 2.0 V.

When the resistance memory cell 320 is subject to a read operation, aread voltage smaller in magnitude than a voltage that would change thestate of the resistance memory cell, i.e., the set voltage or the resetvoltage, is applied across the resistance memory cell 320 is divided asdescribed above between a voltage across the resistance memory element328 and a voltage across the two-terminal access device 326. The smallermagnitude of the read voltage prevents the read voltage from changingthe resistance state of the resistance memory cell 320. In the memoryarray 312, the read voltage has the same polarity as the reset voltage.Application of the read voltage across the memory cell 320 generates aread current that depends on the resistance state of the resistanceelement 328. The above-mentioned sense amplifier (not shown) in the readcircuit 306 (FIG. 3) receives the read current from the resistancememory cell 320 via the bit line decoder 308 and from the read currentdetermines the resistance state of the resistance memory cell 320.

The read current that results from application of the read voltage tothe resistance memory cell 320 is characterized by a read current ratio,which is the ratio between the read current from the resistance memorycell 320 with the resistance memory element 328 in its low-resistancestate and the read current from the resistance memory cell with theresistance memory element in its high-resistance state. As describedabove with reference to FIG. 1, a useable read voltage is one thatprovides an easily-measured read current ratio. A sense amplifier candetermine the resistance state of the resistance memory cell 320 faster,more reliably and with simpler circuitry with a large read current ratiothan with a small read current ratio. Most of examples described hereinare for use with fast, simple sense amplifiers and use a minimum readcurrent ratio of 100. Other examples use a minimum read current ratiogreater than or less than 100. In addition, the useable read voltagediffers from the maximum possible read voltage, i.e., the set voltage orthe reset voltage, by a safety margin that ensures that the readoperation will not inadvertently alter the resistance state of theresistance memory cell 320. The examples described herein use a safetymargin of 200 mV. Other examples use a safety margin greater than orless than 200 mV.

With a low read voltage r applied across the resistance memory cell 320,the resistance of the two-terminal access device 326 dominates theresistance of the resistance memory cell 320 and prevents the senseamplifier (not shown) in the read circuit 306 from reliably determiningthe resistance state of the resistance memory cell. Increasing the readvoltage decreases the dynamic resistance of the two-terminal accessdevice roughly in proportion to the exponent of the increase in readvoltage. At read voltages greater than a threshold voltage, the dynamicresistance of the two-terminal access device 326 becomes sufficientlysmall that the resistance of the resistance memory element becomes asignificant part of the resistance of the resistance memory cell 320.This allows the sense amplifier to determine the resistance state of theresistance memory cell 320 by measuring current from the resistancememory cell. In an example, a relatively complex sense amplifier is ableto determine the resistance state of the resistance memory cell 320 whenthe read voltage is such that the dynamic resistance of the two-terminalaccess device 326 is less than the resistance of the resistance memoryelement 328 in its high-resistance state. In this example, the readcurrent ratio is about 2. In another example, a simpler sense amplifieris able to rapidly and reliably determine the resistance state of theresistance memory cell 320 by using a higher read voltage at which thedynamic resistance of the two-terminal access device 326 is less thanone-hundredth of the resistance of the resistance memory element 328 inits high-resistance state. In this example, the read current ratio isabout 100. Many other combinations of sense amplifier complexity, timeto determine the resistance state of the resistance memory cell 320,read current ratio and read voltage are possible.

As described above, a relatively low set voltage (about 1.2 V in theexample described) applied to a resistance memory cell whose resistancememory element is in the high-resistance reset state is sufficient toset the resistance memory element to the set state. Consequently, aset-polarity read voltage applied to the resistance memory cell 320 hasto be less than the above-described set voltage by the above-describedsafety margin to prevent the read voltage from inadvertently changingthe state of the resistance memory cell when its resistance memoryelement is in its high-resistance reset state. Thus, in the aboveexample, the possible range of the read voltage is from 0V to 1.0 V (200mV less than the magnitude of the exemplary set voltage describedabove).

FIG. 6 is a graph showing the current-voltage characteristic of anexample of the resistance memory cell 320 with a read voltage of the setpolarity. With a read voltage of the set polarity in the permissiblevoltage range from 0 V to about +1.0 V, the dynamic resistance of thetwo-terminal access device 326 is so high compared with the resistanceof the resistance memory element 328 that there is no easily-measureddifference between the read current in the high-resistance reset stateand the read current in the low-resistance set state of the resistancememory cell 320. Nowhere in the permissible range of the set-polarityread voltage does the read current in the high-resistance reset statediffer measurably from the read current in the low-resistance set state.Thus, in this example, no set-polarity read voltage exists that willgive a read current ratio between the read current in low-resistancestate and the read current in the high-resistance state of greater than100, and a read voltage safety margin of 200 mV.

Thus, although it may be possible to perform a read operation using aset-polarity read voltage by reducing the voltage safety margin andusing a read voltage greater than 1 V, the resulting small read voltagerange and small read current ratio would require a more complex senseamplifier. Such a sense amplifier would require a larger chip area andwould require a longer read time to determine the resistance staterepresented by the read current. This would decrease the overall memoryaccess speed. Both of these characteristics are undesirable in alow-cost high-density memory array.

As described above, a reset voltage substantially greater in magnitudethan, and opposite in polarity to (about −2.0 V in the exampledescribed), the set voltage applied to a resistance memory cell 320whose resistance memory element 328 is in the low-resistance set statewill reset the resistance memory cell to its reset state. The resetvoltage is greater in magnitude the set voltage because, in thelow-resistance set state of the resistance memory element, theresistance of the resistance memory element 328 is low, so that most ofthe reset voltage appears across the two-terminal access device 326 andrelatively little of the reset voltage appears across the resistancememory element 328. As a result, a relatively high reset voltage has tobe applied across the resistance memory cell 320 before the voltageacross the resistance memory element 328 exceeds the RESET voltage ofthe resistance memory element and the resistance memory cell 320 returnsto its reset state.

The magnitude of the reset-polarity read voltage applied across theresistance memory cell 320 has to be less than that of the reset voltageby a suitable safety margin to prevent the read voltage frominadvertently changing the state of the resistance memory cell when theresistance memory element 328 is in its low-resistance set state. FIG. 7is a graph showing the current-voltage characteristic of an example ofthe resistance memory cell 320 with a read voltage of the resetpolarity. The range of permissible reset-polarity read voltagemagnitudes from 0 V to 1.8 V (200 mV less than the magnitude of theexemplary reset voltage described above) includes a substantial range ofread voltage magnitudes (from 1.0 V to 1.8 V in the above-describedexample) in which the read voltage provides a voltage across thetwo-terminal access device 326 greater than the above-describedthreshold voltage at which the dynamic resistance of the two-terminalaccess device 326 no longer prevents the sense amplifier fromdetermining the state of the resistance memory cell 320. Moreover, atread voltage magnitudes greater than about 1.4 V, the dynamic resistanceof the two-terminal access device 326 is a sufficiently small fractionof the resistance of the resistance memory cell 320 with the resistancememory element 328 in its reset (high resistance) state that the readcurrent ratio between the set and reset states of the resistance memorycell is greater than 100. Such a read current ratio allows the senseamplifier to rapidly and reliably determine the resistance state of theresistance memory cell. Accordingly, in this example, the resistancememory cell 320 can be read using a read voltage in a range that extendsfrom about −1.4 volts to about −1.8 volts. The larger read voltage rangeand the large read current ratio obtained by reading at the resetpolarity makes it possible for a simple sense amplifier to read thestate of the resistance memory cell rapidly and reliably, and withoutcausing inadvertent state changes.

FIG. 8 is a graph illustrating the dynamic resistance-voltagecharacteristic of the two-terminal access device 326 of the resistancememory cell 320 described in FIGS. 6 and 7. The two-terminal accessdevice 326 is connected in series with the resistance memory element328. In the example shown, the resistance of the resistance memoryelement 328 in its high-resistance state is 10⁸ ohms and the resistanceof the resistance memory element in its low-resistance state is 10⁴ohms. These resistances are substantially voltage-independent in thevoltage range shown. As the magnitude of the voltage across thetwo-terminal access device increases, the dynamic resistance of thetwo-terminal access device rapidly decreases. As the dynamic resistanceof the two-terminal access device falls relative to the resistance ofthe resistance memory cell in its high-resistance state, a discernibledifference appears in the resistance of the resistance memory cellbetween the high-resistance state and the low-resistance state of theresistance memory element 328, and, hence, a corresponding differenceappears in the read current. The resistance of the resistance memorycell 320 is the sum of the dynamic resistance of the two-terminal accessdevice 326 and the resistance (high or low) of the resistance memoryelement 328. With a reset-polarity read voltage having a magnitudegreater than about 1.0V, the resistance of the resistance memory cell320 (and hence in the read current) differs between the high-resistancestate and the low-resistance state of the resistance memory element 328.The difference can be said to be discernible when the dynamic resistanceof the two-terminal access device 326 falls below the resistance of theresistance memory element 328 in its high-resistance state. In contrast,with a set-polarity read voltage within the permissible set-polarityvoltage range, there is a much smaller difference, if any, in theresistance of the resistance memory cell 320 between the high-resistancestate and the low-resistance state of the resistance memory element 328.The cross-hatched region 800 in FIG. 8 shows the voltage range in whichthe dynamic resistance of the two-terminal access device 326 is lessthan the resistance of the resistance memory element 328 in itshigh-resistance state. In this region 800, a measurable differenceexists in the resistance of the resistance memory cell (and hence in theread current) between the high-resistance and low-resistance states ofthe resistance memory element 328.

In embodiments in which the two-terminal access device 326 is embodiedas a tunnel diode, the dimensions of the thin-film metal oxide layer(119 in FIGS. 2A-2C) of the tunnel diode influence the current-voltagecharacteristic of the two-terminal access device. The thickness of thethin-film metal oxide layer can be optimized to maximize the useablerange of the reset-polarity read voltage. In the examples describedherein, the two-terminal access device 326 is embodied as a tunnel diodehaving a metal oxide layer having a thickness in the range from about0.5 nm to about 1 nm.

Accordingly, in a resistance memory cell as disclosed herein, a readoperation uses a read pulse at the reset polarity. A reset-polarity readpulse has an easily-usable voltage range and provides aneasily-detectable read current ratio between the high- andlow-resistance states of the resistance memory cell. In this manner, theread operation will rapidly and reliably read the resistance state ofthe resistance memory cell without inadvertently altering the resistancestate of the resistance memory element. The terminology used herein todescribe the structure of a memory array, e.g., word lines, bit lines,etc., is believed to be widely adopted. However, this terminology is notintended to imply a particular organization of the memory array. Itshould be understood that the memory array is not limited to the arrayconfigurations illustrated herein and additional array configurationscan be used.

The output of a process for designing an integrated circuit, or aportion of an integrated circuit, having one or more of the resistancememory cells described herein may be stored in a computer-readablemedium, such as, but not limited to, a magnetic tape, optical disk,magnetic disk, semiconductor memory, or the like. The computer-readablemedium may be encoded with data structures or other informationdescribing circuitry that may be physically instantiated as anintegrated circuit or a portion of an integrated circuit. Althoughvarious formats may be used for such encoding, these data structures arecommonly written in Caltech Intermediate Format (CIF), Calma GDS IIStream Format (GDSII), or Electronic Design Interchange Format (EDIF).Such data structures can be developed from schematic diagrams of thetype described above and can be encoded the data structures on thecomputer-readable medium. Such encoded data can be used to fabricateintegrated circuits comprising one or more of the resistance memorycells described herein.

Resistance memory cells and memory cells are described herein in detailusing illustrative embodiments. However, the appended claims are notlimited to the precise embodiments described.

We claim:
 1. A resistance memory cell, comprising: an inert electrode;an active electrode; an electrolyte layer disposed between the activeelectrode and the inert electrode, and being adjacent to the activeelectrode; and a two-terminal access device connected in series with theelectrolyte layer, the two-terminal access device including a firstelectrode, a second electrode, and a metal oxide layer interposedbetween the first electrode and the second electrode, wherein the firstelectrode includes the inert electrode and the second electrode includesa contact electrode in contact with the inert electrode.